Wafer probe station incl. mechanical lifting device. During operation the part is held by vacuum. After processing vacuum is switched off and the wafer is lifted up by the device.
These chucks have a porous surface area made out of sinter bronze, ceramic or porous aluminium depending on application and workpiece. METAPOR opens a whole new perspective for different clamping solutions.
Application
Preferred workpieces:
Thin walled (i.e. paper, foils, plate bars, metal strips)
Fine (i.e. optical)
Soft materials (i.e. rubber)
For work such as
High precision measuring
Precision milling
Silicon wafer production
Advantages
Due to the absence of grooves and holes workpieces are not deformed for instance on inserts in the clamping area
Milling through workpiece is possible with using our Friction booster
METAPOR has different quality grades and can also qualify for clean room surrounding (Kl.10)
Handling
Modular chucks can be interconnected to enlarge the surface area
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